Items for Costa, Julio

Up a level
Export as [feed] RSS
Group by: Item Type | No Grouping
Number of items: 6.


Spina, Filippo, Pouryazdan, Arash, Costa, Júlio, Ponce Cuspinera, Luis Ponce and Münzenrieder, Niko (2019) Directly 3D-printed monolithic soft robotic gripper with liquid metal microchannels for tactile sensing. Flexible and Printed Electronics, 4 (3). 035001. ISSN 2058-8585

Costa, Júlio C, Spina, Filippo, Lugoda, Pasindu, Garcia-Garcia, Leonardo, Roggen, Daniel and Münzenrieder, Niko (2019) Flexible sensors—from materials to applications. Technologies, 7 (2). 35 1-83. ISSN 2227-7080

Zaidi, Wan Muhammad Hilmi bin Wan, Costa, Julio, Pouryazdan, Arash, Abdullah, Wan Fazlida Hanim and Munzenrieder, Niko (2018) Flexible IGZO TFT Spice model and design of active strain-compensation circuits for bendable active matrix arrays. IEEE Electron Device Letters, 39 (9). pp. 1314-1317. ISSN 0741-3106

Costa, Júlio C, Wishahi, Amir, Pouryazdan, Arash, Nock, Martin and Münzenrieder, Niko (2018) Hand-drawn resistors, capacitors, diodes, and circuits for a pressure sensor system on paper. Advanced Electronic Materials, 4 (5). p. 1700600. ISSN 2199-160X

Conference Proceedings

Münzenrieder, Niko, Costa, Júlio, Petti, Luisa, Cantarella, Giuseppe, Meister, Tilo, Ishida, Koichi, Carta, Corrado and Ellinger, Frank (2019) Design of bendable high-frequency circuits based on short-channel InGaZnO TFTs. IEEE FLEPS 2019: IEEE International Conference on Flexible and Printable Sensors and Systems, Glasgow, UK, July 7-10 2019. Published in: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). Institute of Electrical and Electronics Engineers ISBN 9781538693049

Costa, Julio C, Pouryazdan, Arash, Panidi, Julianna, Anthopoulos, Thomas, Liedke, Maciej O, Schneider, Christof, Wagner, Andreas and Munzenrieder, Niko (2018) Low temperature and radiation stability of flexible IGZO TFTs and their suitability for space applications. ESSDERC: 48th European Solid-State Device Research Conference, Dresden, Germany, 3-6 September 2018. Published in: 2018 48th European Solid-State Device Research Conference (ESSDERC). Institute of Electrical and Electronics Engineers ISSN 1930-8876 ISBN 9781538654026

This list was generated on Wed May 12 16:16:24 2021 BST.