FLEPS - Design of bendable high-frequency circuits based on short-channel InGaZnO TFTs.pdf (825.76 kB)
Design of bendable high-frequency circuits based on short-channel InGaZnO TFTs
conference contribution
posted on 2023-06-09, 18:42 authored by Niko Munzenrieder, Julio Costa, Luisa Petti, Giuseppe Cantarella, Tilo Meister, Koichi Ishida, Corrado Carta, Frank EllingerA unique requirement of flexible electronic systems is the need to simultaneously optimize their electrical and mechanical performance. Amorphous InGaZnO thin-film transistors (TFTs) fabricated on free-standing large-area plastic substrates address this issue by providing a carrier mobility >10 cm 2 /Vs, and bendability down to radii as small as 25 µm. At the same time, limitations such as a constrained minimum lateral feature size, the lack of appropriate p-type materials, or the influence of strain have to be considered when designing circuits. Here, models describing the scaling and bending behavior of flexible InGaZnO TFTs, together with the design of strain insensitive circuits operating at megahertz frequencies are presented.
History
Publication status
- Published
File Version
- Accepted version
Journal
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)Publisher
Institute of Electrical and Electronics EngineersExternal DOI
Event name
IEEE FLEPS 2019: IEEE International Conference on Flexible and Printable Sensors and SystemsEvent location
Glasgow, UKEvent type
conferenceEvent date
July 7-10 2019Book title
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)ISBN
9781538693049Department affiliated with
- Engineering and Design Publications
Research groups affiliated with
- Sensor Technology Research Centre Publications
Full text available
- Yes
Peer reviewed?
- Yes
Legacy Posted Date
2019-08-22First Open Access (FOA) Date
2019-08-22First Compliant Deposit (FCD) Date
2019-08-22Usage metrics
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