fflexcom_joint_pub_v3.pdf (5.92 MB)
Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems
conference contribution
posted on 2023-06-09, 11:30 authored by Tilo Meister, Frank Ellinger, Johann W Bartha, Manfred Berroth, Joachim Burghartz, Martin Claus, Lothar Frey, Alessio Gagliardi, Marius Grundmann, Jan Hesselbarth, Hagen Klauk, Karl Leo, Paolo Lugli, Stefan Mannsfeld, Yiannos Manoli, Renato Negra, Daniel Neumaier, Ullrich Pfeiffer, Thomas Riedl, Susanne Scheinert, Ullrich Scherf, Andreas Thiede, Gerhard Troster, Martin Vossiek, Robert Weigel, Christian Wenger, Golzar Alavi, Markus Becherer, Carlos Alvarado Chavarin, Mohammed Darwish, Martin Ellinger, Chun-Yu Fan, Martin Fritsch, Frank Grotjahn, Marco Gunia, Katherina Haase, Philipp Hillger, Koichi Ishida, Michael Jank, Stefan Knobelspies, Matthias Kuhl, Grzegorz Lupina, Shabnam Mohammadi Naghadeh, Niko Munzenrieder, Sefa Ozbek, Mahsa Rasteh, Giovanni A Salvatore, Daniel Schrufer, Carsten Strobel, Manuel Theisen, Christian Tuckmantel, Holger von Wenckstern, Zhenxing Wang, Zhipeng ZhangToday, electronics are implemented on rigid substrates. However, many objects in daily-life are not rigid — they are bendable, stretchable and even foldable. Examples are paper, tapes, our body, our skin and textiles. Until today there is a big gap between electronics and bendable daily-life items. Concerning this matter, the DFG Priority Program FFlexCom aims at paving the way for a novel research area: Wireless communication systems fully integrated on an ultra-thin, bendable and flexible piece of plastic or paper. The Program encompasses 13 projects led by 25 professors. By flexibility we refer to mechanical flexibility, which can come in flavors of bendability, foldability and, stretchability. In the last years the speed of flexible devices has massively been improved. However, to enable functional flexible systems and operation frequencies up to the sub-GHz range, the speed of flexible devices must still be increased by several orders of magnitude requiring novel system and circuit architectures, component concepts, technologies and materials.
History
Publication status
- Published
File Version
- Accepted version
Journal
2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)Publisher
IEEEExternal DOI
Page range
1-6Event name
Microwaves, Antennas, Communications and Electronic Systems (COMCAS), 2017 IEEE International Conference onEvent location
Tel-Aviv, IsraelEvent type
conferenceEvent date
13-15 Nov. 2017Book title
2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)Department affiliated with
- Engineering and Design Publications
Research groups affiliated with
- Sensor Technology Research Centre Publications
Notes
© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksFull text available
- Yes
Peer reviewed?
- Yes
Legacy Posted Date
2018-01-10First Open Access (FOA) Date
2018-01-10First Compliant Deposit (FCD) Date
2018-01-10Usage metrics
Categories
No categories selectedKeywords
Licence
Exports
RefWorks
BibTeX
Ref. manager
Endnote
DataCite
NLM
DC