Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

Meister, Tilo, Ellinger, Frank, Bartha, Johann W, Berroth, Manfred, Burghartz, Joachim, Claus, Martin, Frey, Lothar, Gagliardi, Alessio, Grundmann, Marius, Hesselbarth, Jan, Klauk, Hagen, Leo, Karl, Lugli, Paolo, Mannsfeld, Stefan, Manoli, Yiannos, Negra, Renato, Neumaier, Daniel, Pfeiffer, Ullrich, Riedl, Thomas, Scheinert, Susanne, Scherf, Ullrich, Thiede, Andreas, Troster, Gerhard, Vossiek, Martin, Weigel, Robert, Wenger, Christian, Alavi, Golzar, Becherer, Markus, Chavarin, Carlos Alvarado, Darwish, Mohammed, Ellinger, Martin, Fan, Chun-Yu, Fritsch, Martin, Grotjahn, Frank, Gunia, Marco, Haase, Katherina, Hillger, Philipp, Ishida, Koichi, Jank, Michael, Knobelspies, Stefan, Kuhl, Matthias, Lupina, Grzegorz, Naghadeh, Shabnam Mohammadi, Munzenrieder, Niko, Ozbek, Sefa, Rasteh, Mahsa, Salvatore, Giovanni A, Schrufer, Daniel, Strobel, Carsten, Theisen, Manuel, Tuckmantel, Christian, von Wenckstern, Holger, Wang, Zhenxing and Zhang, Zhipeng (2018) Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems. Microwaves, Antennas, Communications and Electronic Systems (COMCAS), 2017 IEEE International Conference on, Tel-Aviv, Israel, 13-15 Nov. 2017. Published in: 2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS). 1-6. IEEE

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Today, electronics are implemented on rigid substrates. However, many objects in daily-life are not rigid — they are bendable, stretchable and even foldable. Examples are paper, tapes, our body, our skin and textiles. Until today there is a big gap between electronics and bendable daily-life items. Concerning this matter, the DFG Priority Program FFlexCom aims at paving the way for a novel research area: Wireless communication systems fully integrated on an ultra-thin, bendable and flexible piece of plastic or paper. The Program encompasses 13 projects led by 25 professors. By flexibility we refer to mechanical flexibility, which can come in flavors of bendability, foldability and, stretchability. In the last years the speed of flexible devices has massively been improved. However, to enable functional flexible systems and operation frequencies up to the sub-GHz range, the speed of flexible devices must still be increased by several orders of magnitude requiring novel system and circuit architectures, component concepts, technologies and materials.

Item Type: Conference Proceedings
Additional Information: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works
Schools and Departments: School of Engineering and Informatics > Engineering and Design
Research Centres and Groups: Sensor Technology Research Centre
Depositing User: Niko Munzenrieder
Date Deposited: 10 Jan 2018 11:59
Last Modified: 16 Feb 2022 12:35

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