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Encapsulation for flexible electronic devices

journal contribution
posted on 2023-06-08, 19:59 authored by T Kinkeldei, Niko Munzenrieder, C Zysset, K Cherenack, G Tröster
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History

Publication status

  • Published

Journal

IEEE Electron Device Letters

ISSN

0741-3106

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Issue

12

Volume

32

Page range

1743-1745

Department affiliated with

  • Engineering and Design Publications

Full text available

  • No

Peer reviewed?

  • Yes

Legacy Posted Date

2015-02-06

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